LC Signal Semiconductors & Electronics

GlobalFoundries Agrees to Manufacture Interposers for TSMC in the U.S.: Expanding Supply Capacity for Advanced AI Packaging

On October 8, GlobalFoundries (GF) announced an agreement
to manufacture silicon interposers in the U.S.
for TSMC’s CoWoS advanced packaging technology.
GF will add manufacturing capacity at its facility in Malta, New York,
to meet demand for AI and high-performance computing.
The agreement is valued at US$2 billion,
with volume production expected to begin ramping in the first half of 2028.

What Was Announced: Manufacturing Components for TSMC at GF’s U.S. Facility

Under the agreement, GF will provide manufacturing services to TSMC.
The agreement has an initial term of five years
and provides a framework for expanding capacity in the future
as customer demand grows.
The announcement concerns the manufacturing agreement and plans to add capacity;
it does not announce the start of volume production.

GF expects to establish the first U.S.-based source
of silicon interposers supporting advanced packaging technologies,
including embedded deep trench capacitor components.
The additional capacity is planned to support multiple product generations.

The Role of the Technology: Combining Compute Chips and Memory in One Package

According to TSMC’s official explanation, CoWoS is an advanced packaging technology
that integrates compute chips with high-bandwidth memory (HBM) and other components
in a single package.
It addresses not only the manufacturing of semiconductor chips themselves
but also how multiple chips are connected.

In CoWoS-S, high-density interconnects and capacitors
are built into a silicon interposer,
on which compute chips and HBM are placed.
The interposer serves as the base that connects these components.
TSMC also offers CoWoS-R and CoWoS-L, which use different structures
depending on the application.

What Changes: Increasing Supply Capacity for Advanced Packaging Components

GF says the agreement will provide greater scale and flexibility
in supplying components for advanced packaging.
The company explains that advanced packaging is becoming increasingly critical
to delivering the performance, power efficiency, and scale
required for next-generation AI systems.

In its official technology overview, TSMC also states its plan
to increase CoWoS interposer sizes to accommodate more compute chips and HBM,
achieving greater compute power and memory bandwidth.
This agreement expands U.S. manufacturing of the components
that support that packaging.

LC Signal’s Perspective: Securing Capacity for the “Connecting Components” Behind AI Chips

The interposer is the base on which compute chips and HBM are placed and connected.
Even with enough compute chips, a product cannot be completed
without enough of these base components.
When considering the supply of AI chips,
it seems necessary to look not only at compute chips
but also at manufacturing plans for components like these.

GF expects volume production to begin ramping in the first half of 2028,
and the agreement has an initial term of five years.
The agreement is easiest to understand as one that secures capacity
with multiple product generations and future demand growth in view,
beyond adding near-term supply.

Related article:

Xanadu and GlobalFoundries Partner to Manufacture Photonic Quantum Computing Components: Aiming for a Move to a 300 mm Line

Key Sources

This article was prepared with AI assistance using publicly available information
as of October 9, 2026.
Announcement dates follow the dates shown on the official pages.
Capacity expansion and the production ramp are plans
and are distinguished from what has already been carried out.
The structure of CoWoS is explained as technical background
and does not indicate the specific specifications used under this agreement.
“LC Signal’s Perspective” reflects this publication’s interpretation
of the available information.

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